Home  |   Login  |   Logout  |   Access Information  |   Alerts  |   Purchase History  |   Cart  |   Sitemap  |   Help   
 
Abstract
BROWSE SEARCH IEEE XPLORE GUIDE SUPPORT
arrow_leftView TOC   |arrow_leftPrevious Article   |  Next Articlearrow_right
Email/Printer Friendly Format  
 

Formal verification at higher levels of abstraction
Kroening, D.   Seshia, S.A.  
Oxford Univ., Oxford;

This paper appears in: Computer-Aided Design, 2007. ICCAD 2007. IEEE/ACM International Conference on
Publication Date: 4-8 Nov. 2007
On page(s): 572-578
Location: San Jose, CA,
ISSN: 1092-3152
ISBN: 978-1-4244-1382-9
INSPEC Accession Number: 9789825
Digital Object Identifier: 10.1109/ICCAD.2007.4397326
Current Version Published: 2007-12-10

Abstract
Most formal verification tools on the market convert a high-level register transfer level (RTL) design into a bit-level model. Algorithms that operate at the bit-level are unable to exploit the structure provided by the higher abstraction levels, and thus, are less scalable. This tutorial surveys recent advances in formal verification using high-level models. We present word-level verification with predicate abstraction and satisfiability modulo theories (SMT) solvers. We then describe techniques for term-level modeling and ways to combine word-level and term-level approaches for scalable verification.

Index Terms
Available to subscribers and IEEE members.

References
Available to subscribers and IEEE members.
Citing Documents
Available to subscribers and IEEE members.
You are not logged in.
Guests may access Abstract records free of charge.
Login
Username
Password
» Forgot your password?
Please remember to log out when you have finished your session.
You must log in to access:
• Advanced or Author Search
• CrossRef Search
• AbstractPlus Records
• Full Text PDF
• Full Text HTML
Access this document
Full Text: PDF (310 KB)
» Buy this document now
»  Learn more about
»  Learn more about
    purchasing articles
    and standards

Rights and Permissions
» Learn More
Download this citation
Available to subscribers and IEEE members.
 
arrow_leftView TOC   |arrow_leftPrevious Article   |  Next Articlearrow_right   |  Back to toparrow_up
Indexed by IEE Inspec
© Copyright 2009 IEEE – All Rights Reserved