Can nano-photonic silicon circuits become an INTRA-chip interconnect technology?
Yablonovitch, E.
Univ. of California, Berkeley;
This paper appears in: Computer-Aided Design, 2007. ICCAD 2007. IEEE/ACM International Conference on
Publication Date: 4-8 Nov. 2007
On page(s): 309-309
Location: San Jose, CA,
ISSN: 1092-3152
ISBN: 978-1-4244-1382-9
INSPEC Accession Number: 9789781
Digital Object Identifier: 10.1109/ICCAD.2007.4397282
Current Version Published: 2007-12-10
Abstract
Surprisingly, nano-photonk silicon has already emerged as a commercial INTER-chip optical communications technology. This was made possible by Silicon-on-Insulator (SOI), technology, which integrates many of the optical communications components directly in silicon CMOS chips. Intel and Luxtera have both announced > 10Gb/sec optical modulators, integrated into silicon. All the other customarily required opto-electronic components; detectors, waveguides, splitters, couplers, filters, etc., are fully executed in CMOS designs, as well. Continuous wave optical power is provided from off-chip, just as dc power is currently provided from off-chip. The initial commercial applications are optical 10Gb/s Ethernet, Infiniband, and other INTER-chip, communications applications. The question to be addressed in this talk, is whether silicon nano-photonics can now make the final jump, to INTRA-chip optical interconnects?
Index
Terms
Available to subscribers and IEEE members.
References
Available to subscribers and IEEE members.
Citing Documents
Available to subscribers and IEEE members.